PowerAmerica is pleased to announce the recent kickoff of four new projects to accelerate SiC and GaN technology – selected by members. As part of membership in PowerAmerica, members utilize their dues to fund wide bandgap projects that they select based on areas of interest to PowerAmerica membership and the SiC and GaN ecosystem. Want to have a voice in driving the wide bandgap power electronics industry forward in the U.S.? Reach out to our Membership Director Jim LeMunyon about joining PowerAmerica.
The member-initiated projects are:
- Quantifying Power Device Reliability Due to Terrestrial and Other Radiation Sources (Akin Akturk, CoolCAD Electronics)
- Establish an Independent Testing Facility to Perform Reliability Analysis of Wide Bandgap Semiconductor Devices (Stephen Bayne, Texas Tech/Group NIRE)
- High Voltage Bi-Directional On-Board Charger with Integrated PCB Winding Magnetic Components (Qiang Li, Virginia Tech)
- Short-Circuit Behavior and Protection of Next Generation 1.2kV SiC Modules (Jin Wang, The Ohio State University)