PowerAmerica’s 2017 Call for Projects has been issued. The concept paper due date is Nov. 10, 2017, with a full submission deadline of Dec. 22, 2017.
This Call for Projects is primarily focused on the manufacturing of SiC and GaN power semiconductor devices, wide bandgap power electronics architectures and assemblies, and packaging and manufacturing processes with the potential to improve performance, lower cost, and create U.S. manufacturing jobs. Demonstration of WBG devices in high volume commercially viable power electronic applications is desired.
Teaming between companies, and between companies/national laboratories/universities is strongly encouraged.
More details are available on the Call for Projects website.