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PowerAmerica News

PowerAmerica 2.0 RFP Now Open

Our latest request for proposals (RFP) will remain open until Dec. 12, which is the submission deadline for required concept papers.

Silicon semiconductor wafer close-up. In electronics, a wafer also called a slice or substrate is a thin slice of semiconductor, a crystalline silicon, used for the fabrication of integrated circuits

PowerAmerica released today a new request for proposals (RFP) on research projects to further accelerate the commercialization of wide-bandgap semiconductor materials — silicon carbide (SiC) and gallium nitride (GaN) — into chips and power electronics.

The total worth of funding for R&D projects supported by “PowerAmerica 2.0” will be roughly $26 million (inclusive of cost-match), broken into the following categories:

  • $9 million in Industry Projects (plus $9M in cost-match);
  • $3.2 million in University Projects (plus $3.2M in cost-match); and
  • $900,000 in Member Initiated Projects (plus $450K in cost-match).

Concept papers are mandatory for full proposal submission — and the Dec. 12 deadline is firm. Full proposals will only be accepted from applicants who receive an “Encourage” recommendation in response to their concept paper submission.

Please direct any questions to poweramerica@ncsu.edu.