Ekaterina Muravleva

School/year: University of Nebraska-Lincoln, Ph.D.
Graduate/Undergraduate: Graduate
Graduation Date: Fall 2025
Major: Electrical Engineering
PowerAmerica Project: Optimization, fabrication, simulation and testing of press-pack packaging of SiC devices.
Areas of Expertise: Power electronics packaging, Semiconductor device modeling, Wide-bandgap power semiconductors, Semiconductor device simulation and optimization, Thermal management, Power electronics design.