Ekaterina Muravleva
School/year:
University of Nebraska-Lincoln,
Ph.D.
Graduate/Undergraduate:
Graduate
Graduation Date:
Fall 2025
Major:
Electrical Engineering
PowerAmerica Project:
Optimization, fabrication, simulation and testing of press-pack packaging of SiC devices.
Areas of Expertise:
Power electronics packaging, Semiconductor device modeling, Wide-bandgap power semiconductors, Semiconductor device simulation and optimization, Thermal management, Power electronics design.